Technical parameters: Technical parameters

Model: SPS-9600

Dimensions:

L600*W1260*H1380mm

control method:

Motion control card + industrial computer

Dispensing area:

(X/Y/Z)X=300mm Y=400mm Z=50mm

Track load:

4kg

X/Y/Z drive mode:

Servo motor + ball screw

Maximum operating speed:

1500mm/S, acceleration 2G

positioning accuracy:

±0.01mm

Repeatability:

±0.01mm

Weighing system:

0.1mg

Equipped with high-speed piezoelectric injection valve:

1 set

Heating temperature of the valve:

0-120℃

Communication Interface:

SMEMA, can be connected to MES management system

Programming mode:

Offline or online visual programming

Input voltage:

220V 50-60HZ

Enter air pressure:

0.6MPa

Total power:

3KW

total weight:

390kg

The optional items are as follows

Laser height measurement:

Laser automatic height detection, after the workpiece is deformed, the height difference of the Z axis can be automatically adjusted and calibrated

Injection valve:

Imported or domestically available

visual identification system:

Optional according to requirements

Analytical Balances:

Automatic weighing analytical balance

Workpiece heating device:

Heating under working area, room temperature~130℃±2℃

Product Features:  

1. Non-contact injection valve, the Z axis does not need to be lifted, thus broadening the application field

2. Mature and stable high-speed, high-precision motion platform

3. Automatic constant temperature to ensure consistent paint fluidity

4. Equipped with a high-precision weighing system to ensure consistent glue volume, reduce material waste, and increase productivity and yield

5. Online conveying system, which can communicate with other equipment

6. Precise vision positioning and automatic vision sampling system

7. Automatic height measurement system, no effect of substrate warpage

8. Windows interface control software is easy to operate and easy to program

9. Can be equipped with injection valve, screw valve and air pressure valve arbitrarily

10. Modular design, can be equipped with optional functions arbitrarily

11. High-speed injection, up to 200-3000 times per second optional

12. The size of the point can be set arbitrarily, which can achieve a smaller dispensing diameter

13. Vacuum cleaning nozzle device

product manual

The SPS-9600 high-speed dispensing system adopts a non-contact jet dispensing valve. It has the characteristics of precise, high-speed dispensing and filling. It can achieve a smaller dispensing diameter and does not require Z-axis lifting during work, which breaks through the traditional contact type. The dispensing method solves the defects of sharpening, uneven glue amount, damage to components and products. Greatly improve work efficiency and product quality. Adopt modular design, flexible application configuration.

Application scope:

 • Solder paste spraying

• Underfill

• FPC package

• SMT dot red glue

• Some silver paste

• undrfill

• LED package

• Component packaging

• Surface mount

• Precision coating

• Semiconductor chip packaging

Product advantages:

■ 0~6Bar low pressure operation

■ Less consumables, economical price

■ The minimum injection volume is 0.002 microliters

■ Non-contact, needleless design

■ High precision (with volume error within 1%)

■ The nozzle can be heat-resistant, and the temperature distribution is even

■ Adopt quick release nozzle design

■ The fastest spraying speed 3000 times/sec. Open and close Optional items:

■Hot melt glue can be applied

■Can spray solder paste

■Vacuum cleaning nozzle device system

■Automatic weighing system

■Automatic height measurement system

■Heating device

Application industry:

■ Communication industry: hot melt glue, UV glue, conductive silver paste

■ Optical communications industry: applications such as silica gel, optical glue, micro-dispensing, packaging, etc.

■ Biomedicine industry: biological spermatogonial cell transport, protein ratio, etc.

■ LED manufacturing: phosphor dispensing, filling glue potting, LED flexible strip packaging and other applications

■ Electronic industry: SMT, PCB board, LCD, components, housing, insulator, etc.